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FPC flexible circuit board splicing principles

FPC flexible circuit board in the production process, in order to save money, improve the production efficiency, reduce the production cycle, usually choose the method of collage, rather than single production.  Usually FPC flexible circuit board has three kinds of conventional jigging, oblique and inverted jigging methods, all of the jigging method, under the condition of being able to make, must be in accordance with the principle of saving raw materials.  So what are the splicing principles of FPC flexible circuit board?  Here is a brief overview:  

 

 

 

1, in each process can be produced under the conditions, although the "squeeze".  The so-called "squeeze" is to reduce the interval between adjacent plates and plates, thus reducing the size of the whole plate, saving the production of raw materials to reduce the production cost.  

 

 

 

2. The spacing between single plates is at least greater than 2mm, which is to meet the needs of positioning holes. In the batch production process, molding usually adopts the method of die punching.  In the process of sample making, laser cutting is usually used to shape, in order to prevent the slight deviation, prevent the occurrence of a partial and the whole piece of partial condition, the single piece can not be directly connected, so that the two do not affect each other.  

 

 

 

3. Etch characters should be added to the Mosaic, and simple footnotes should be made to the size and number of the Mosaic, so as to facilitate verification and verification in subsequent production.  

 

 

 

4. Add positioning holes at the four corners of all the plates, and select one corner to mark the difference positioning holes, so as to facilitate the maintenance of the target in the subsequent production process, so as not to cause the sealing film sticking back, character printing back and so on.  

 

 

 

5. The width of the Mosaic shall not become 250mm, and the length shall be within 250mm as far as possible.  The larger the size of the Mosaic, the greater the offset, the worse the production accuracy, the higher the defect rate of molded goods.  

 


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